Molybdenum Copper Properties
Molybdenum-copper alloy is a versatile material with a unique combination of thermal, electrical, and mechanical properties. Its ability to balance thermal conductivity and expansion makes it ideal for heat dissipation components, electronic packaging, and high-temperature structural applications.
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Key Properties:
1.High Thermal Conductivity:
Ranges from 165–250 W/m·K, depending on the Mo-Cu ratio.
Provides efficient heat dissipation, making it ideal for heat sink applications.
2.Low Coefficient of Thermal Expansion (CTE):
Can be adjusted between 6.8 × 10⁻⁶/K and 11.5 × 10⁻⁶/K by modifying the Mo-Cu composition.
Matches semiconductor and ceramic materials, reducing thermal stress in electronic applications.
3.Excellent Electrical Conductivity:
Copper content improves electrical performance, making it suitable for electrical contacts and electrodes.
4.High Melting Point & Temperature Stability:
Molybdenum has a melting point of 2,623°C, significantly enhancing Mo-Cu alloy's high-temperature resistance.
Ensures performance stability in extreme heat environments, such as aerospace and power electronics.
5.Good Mechanical Strength & Wear Resistance:
Maintains mechanical integrity under high-stress and high-temperature conditions.
Offers resistance to arc erosion in electrical contacts.
6.Non-Magnetic & Corrosion-Resistant:
Suitable for sensitive electronic applications requiring non-magnetic materials.
Resists oxidation and corrosion in harsh environments.
7.Lightweight Compared to Tungsten-Copper (W-Cu):
Density of 9.5–10.0 g/cm³, significantly lower than tungsten-copper, making it more suitable for aerospace and lightweight designs.
Composition & Variability
Typical Mo-Cu Ratios: Mo85Cu15, Mo75Cu25, Mo70Cu30, Mo60Cu40, Mo50Cu50.
Higher Mo content provides lower thermal expansion and higher temperature resistance.
Higher Cu content increases thermal and electrical conductivity.
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